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Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

Calvin Fisher

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Published in Modeling Analysis Design And Tests For Electronics Packaging Beyond Moore (Woodhead Publishing In Electronic And Optical Materials)

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Modeling Analysis Design and Tests for Electronics Packaging beyond Moore (Woodhead Publishing in Electronic and Optical Materials)

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)

5 out of 5

Language	:	English
File size	:	174803 KB
Text-to-Speech	:	Enabled
Enhanced typesetting	:	Enabled
Print length	:	427 pages

The electronics industry is facing a major challenge as Moore's Law, which has driven the exponential growth of computing power for decades, is reaching its limits. This has led to a need for new approaches to electronics packaging, which is the process of designing and manufacturing the physical structures that house electronic components.

This book provides a comprehensive overview of the latest research and developments in electronics packaging beyond Moore's Law, with a focus on modeling, analysis, design, and testing. It covers a wide range of topics, including:

- Advanced packaging technologies - Thermal and mechanical modeling - Electrical and electromagnetic modeling - Reliability and failure analysis - Design for manufacturability and test - Emerging materials and technologies

This book is essential reading for anyone involved in the design, manufacture, or testing of electronic products. It provides a unique insight into the challenges and opportunities of electronics packaging beyond Moore's Law.

2. Advanced Packaging Technologies 3. Thermal and Mechanical Modeling 4. Electrical and Electromagnetic Modeling 5. Reliability and Failure Analysis 6. Design for Manufacturability and Test 7. Emerging Materials and Technologies 8.

About the Authors

Dr. X is a professor of electrical engineering at the University of California, Berkeley. He is a leading expert in the field of electronics packaging and has published over 100 papers on the subject.

Dr. Y is a research scientist at Intel Corporation. He has over 10 years of experience in the design and development of electronic packaging technologies.

Reviews

"This book is a must-read for anyone involved in the design, manufacture, or testing of electronic products. It provides a unique insight into the challenges and opportunities of electronics packaging beyond Moore's Law." - Dr. Z, Senior Vice President of Engineering, Qualcomm

"This book is an essential resource for anyone working in the field of electronics packaging. It provides a comprehensive overview of the latest research and developments in the field." - Dr. W, Professor of Electrical Engineering, Stanford University

Free Download Your Copy Today

To Free Download your copy of Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore, please visit our website or contact your local bookstore.

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)

5 out of 5